Huaswin Electronics Co.,Limited
5 1

Multi Layer Turnkey PCB Assembly / Prototype Printed Circuit Boards Assembly

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Huaswin Electronics Co.,Limited
[China]

Address
28D, Block D, Jin Gang Hua Ting, Xi Xiang, Bao An beijing beijing
Phone
86-755-29077956
Contact name
Vicky

Quick Information

  • Brand Name: HUASWIN
  • Place of Origin: China
  • Model Number : HSPCBA1001

Description

Multi Layer Turnkey PCB Assembly / Prototype Printed Circuit Boards Assembly 

Specifications

1. Electronics PCB and PCB assembly manufacturer 
2. UL,RoHS,SGS, ISO Approved 
3. Reliable OEM / ODM PCB assembly 
4. High Quality, fast delivery 

Huaswin Electronics offers customer two options when it comes to PCB Assembly Services, Full or Partial 

Turn-Key PCB Assembly service.

Full Turn-Key service takes care of the entire process including PCB Fabrication, Component Procurement, 

PCB Assembly and testing. For customers who do not require the full Turn-Key solution then Partial Turn-Key 

will fit the bill.

With Partial Turn-Key, you provide the blank PCBs and we assemble according to your requirements. You have

the option of providing some or all of the components, and Huaswin’s dedicated Procurement team will assist 

with any remaining parts. 

Welcome to Huaswin!

Huaswin Electronics is a professional PCB & PCB Assembly manufacturer, located in Shenzhen, China.

We supply one-stop facility services: PCB design, PCB fabrication, components procurement, SMT and DIP 

assembly ,IC pre-programming / burning on-line, testing, packing. 

PCB capability and services: 


1. Single-sided, double-sided & multi-layer PCB (up to 30 layers)

2. Flexible PCB (up to 10 layers)

3. Rigid-flex PCB (up to 8 layers) 

4. CEM-1, CEM-3 FR-4, FR-4 High TG, Polyimide, Aluminum-based material. 
5. HAL, HAL lead free, Immersion Gold/ Silver/Tin, Hard Gold, OSP surface treatment. 
6. Printed Circuit Boards are 94V0 compliant, and adhere to IPC610 Class 2 international PCB standard. 
7. Quantities range from prototype to volume production. 
8. 100% E-Test 

Detailed Specification of PCB Manufacturing

1

layer

1-30 layer

2

Material

CEM-1, CEM-3 FR-4, FR-4 High TG, Polyimide, Aluminum-based

 material. 

3

Board thickness

0.2mm-6mm

4

Max.finished board size

800*508mm

5

Min.drilled hole size

0.25mm

6

min.line width

0.075mm(3mil)

7

min.line spacing

0.075mm(3mil)

8

Surface finish

HAL, HAL Lead free,Immersion Gold/ Silver/Tin, Hard Gold, 

OSP

9

Copper thickness

0.5-4.0oz

10

Solder mask color

green/black/white/red/blue/yellow

11

Inner packing

Vacuum packing,Plastic bag

12

Outer packing

standard carton packing

13

Hole tolerance

PTH:±0.076,NTPH:±0.05

14

Certificate

UL,ISO9001,ISO14001,ROHS,TS16949

15

Profiling punching

Routing,V-CUT,Beveling


PCB Assembly services: 

SMT Assembly 
Automatic Pick & Place 
Component Placement as Small as 0201 
Fine Pitch QEP - BGA 
Automatic Optical Inspection 

Through-hole Assembly 
Wave Soldering 
Hand Assembly and Soldering 

Material Sourcing 
IC pre-programming / Burning on-line 

Function testing as requested 

Aging test for LED and Power boards

Complete unit assembly (which including plastics, metal box, Coil, cable assembly etc) 
Packing design

Conformal coating
Both dip-coating and vertical spray coating is available. Protecting non-conductive dielectric layer that is

 applied onto the printed circuit board assembly to protect the electronic assembly from damage due to 

contamination, salt spray, moisture, fungus, dust and corrosion caused by harsh or extreme environments. 

When coated, it is clearly visible as a clear and shiny material.


Complete box build
Complete 'Box Build' solutions including materials management of all components, electromechanical parts, 

plastics, casings and print & packaging material

Testing Methods

AOI Testing
·Checks for solder paste 
·Checks for components down to 0201" 
·Checks for missing components, offset, incorrect parts, polarity

X-Ray Inspection
X-Ray provides high-resolution inspection of: 
·BGAs 
·Bare boards 

In-Circuit Testing
In-Circuit Testing is commonly used in conjunction with AOI minimizing functional defects caused by 

component problems. 
· Power-up Test
· Advanced Function Test
· Flash Device Programming
· Functional testing

Detailed Specification of Pcb Assembly

1

Type of Assembly

SMT and Thru-hole

2

Solder Type

Water Soluble Solder Paste,Leaded and Lead-Free

3

Components

Passives Down to 0201 Size

BGA and VFBGA

Leadless Chip Carries/CSP

Double-Sided SMT Assembly

Fine Pitch to 08 Mils

BGA Repair and Reball

Part Removal and Replacement-Same Day Service

3

Bare Board Size

Smallest:0.25x0.25 Inches

Largest:20x20 Inches

4

File Formats

Bill of Materials 

Gerber Files

Pick-N-Place File(XYRS)

5

Type of Service

Turn-Key,Partial Turn-Key or Consignment

6

Component Packaging

Cut Tape

Tube

Reels

Loose Parts

7

Turn Time

15 to 20 days 

8

Testing

AOI inspection

X-Ray inspection

In-Circuit testing

Functional test


Product Image

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